Testing of glass; testing the effect of alternating atmosphere on multilayer insulating glass

玻璃的检验.多层绝缘玻璃的气候适应性检验

HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. FIXED MULTILAYER CERAMIC CHIP CAPACITORS. SECTION SPECIFICATION. BLANK DETAIL SPECIFICATION. (SPECIFICATION CECC 32 100 AND CECC 32 101).

电子件.质量评估评定协调体系.固定多层陶瓷片电容器.分规范.空白详细规范

Harmonized system of quality assessment for electronic components-Sectional specification: fixed multilayer ceramic surface mounting capacitors-Assessment levels EZ and DZ

电子件质量评定的协调系统.分规范:固定的多层陶瓷表面镶嵌电容器.评估级别EZ和DZ

Harmonized system of quality assessment for electronic components; sectional specification: fixed multilayer ceramic chip capacitors

电子件质量评定协调体系.分规范.多层陶瓷片状电容器(CECC32100)

Specification for harmonized system of quality assessment for electronic components-Fixed capacitors for use in electronic equipment-Blank detail specification-Fixed multilayer ceramic chip capa

电子件质量评定协调体系规范.电子设备用固定电容器.空白详细规范.固定多层陶瓷片电容器

Harmonized system of quality assessment for electronic components-Sectional specification-Flexible multilayer printed boards with through connections

电子件质量评定协调系统.分规范.连接起来的柔性多层印制电路板

Harmonized system of quality assessment for electronic components-Fixed capacitors for use in electronic equipment-Sectional specification for fixed multilayer ceramic chip capacitors

电子器件质量评定协调体系.电子设备用固定电容器.多层陶瓷片固定电容器分规范

Harmonized system of quality assessment for electronic components-Sectional specification-Flex-rigid multilayer printed boards with through connections

电子器件质量评定协调体系.分规范.连接起来的挠曲-刚性多层印制电路板

Harmonized system of quality assessment for electronic components-Capability detail specification: multilayer printed boards

电子器件质量评定协调体系.性能详细规范:多层印制电路板

Harmonized system of quality assessment for electronic components-Capability detail specification: flexible multilayer printed boards with through connections

电子器件质量评定协调体系.性能详细规范:整体连接挠性多层印制电路板

Harmonized system of quality assessment for electronic components-Capability detail specification: flex-rigid multilayer printed boards with through connections

电子器件质量评定协调体系.性能详细规范:整体连接弯曲刚性多层印制电路板

Specification for harmonized system of quality assessment for electronic components-Sectional specification-Multilayer printed boards

电子器件质量评定协调体系规范.性能分规范:多层印制电路板

Fixed capacitors for use in electronic equipment; part 10: sectional specification: fixed multilayer ceramic chip capacitors; identical with IEC 60384-10:1989

电子设备用固定电容器.第10部分:空白分规范:表面安装的多层瓷片固定电容器

Fixed capacitors for use in electronic equipment; part 10: blank detail specification: fixed multilayer ceramic chip capacitors; assessment level E; identical with IEC 60384-10-1:1989

电子设备用固定电容器.第10部分:空白分规范:表面安装的多层瓷片固定电容器.E级质量评定

Fixed capacitors for use in electronic equipment--Part 10: Sectional specification--Fixed multilayer ceramic chip capacitors

电子设备用固定电容器第10部分:分规范多层片式瓷介电容器

Fixed capacitors for use in electronic equipment--Part 10: Blank detail specification Fixed multilayer ceramic chip capacitors Assessment level E

电子设备用固定电容器第10部分:空白详细规范多层片式瓷介电容器评定水平E

Multilayer co-extrusion feedblock, allowing for coextrusion of up to 7 kinds of raw materials.

多层共挤复合分配器,最多达七种成分原料共挤复合挤出。

multilayer and high density fine-pitch printed circuit board

多层和高密度细线距的印刷电路板;多层和高密度细线距的线路板

Metallic multilayer plain bearings-Method for non-destructive ultrasonic testing of bond

多层金属滑动轴承.第1部分:结合力的无损超声波检验方法

Metallic multilayer plain bearings-Method for destructive testing of bond for bearing metal layer thickness

多层金属滑动轴承.第2部分:2mm厚轴承金属层的结合力的破坏性检验方法

Metallic multilayer plain bearings-Method for non-destructive die penetrant testing

多层金属滑动轴承.第3部分:模的无损透过检验方法

multilayer gas-discharge display panel

多层气体放电显示板

Test method for insulation resistance between layers of multilayer printed boards

多层印制板层间绝缘电阻测试方法

deposition thin film substrate version of multilayer module (MCM-D)

多芯片模块薄膜基板

Sectional specification-Flexible multilayer printed boards with through connection;

分规范.带贯通连接的挠性多层印制电路板

Sectional specification-Flex-rigid multilayer printed boards with through connections;

分规范.带贯通连接的弯曲刚性多层印制电路板

Sectional specification: multilayer printed boards;

分规范.多层印制电路板

Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板

multilayer card

多层插卡

multilayer board

多层板

multilayer resist

多层保护膜

multilayer wiring

多层布线

multilayer lining

多层衬里

multilayer routing

多层布线

multilayer network

多层薄膜网路

multilayer network

多层薄膜回路

multilayer frontier

多层边界

multilayer material

多层材料

multilayer cassette

多层储片夹

multilayer packaging

多层包装法

multilayer substrate

多层衬底

multilayer radiography

多层X线摄影

wiring multilayer film

多层布线膜

multilayer film circuit

多层薄膜电路

multilayer wiring method

多层布线法

multilayer cassette tray

多层储片夹托盘

multilayer interconnection

多层接线

thin type multilayer board

薄型多层板